74LCX162244(2001) 查看數據表（PDF） - Fairchild Semiconductor

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74LCX162244
(Rev.:2001)

Low Voltage 16-Bit Buffer/Line Driver with 26Ω Series Resistors in Outputs

Fairchild Semiconductor 

September 2000

Revised August 2001

74LCX162244

Low Voltage 16-Bit Buffer/Line Driver

with 26Ω Series Resistors in Outputs

General Description

The LCX162244 contains sixteen non-inverting buffers with

3-STATE outputs designed to be employed as a memory

and address driver, clock driver, or bus oriented transmit-

ter/receiver. The device is nibble controlled. Each nibble

has separate 3-STATE control inputs which can be shorted

together for full 16-bit operation.

The LCX162244 is designed for low voltage (2.5V or 3.3V)

VCC applications with capability of interfacing to a 5V signal

environment.

In addition, the outputs include equivalent 26Ω (nominal)

series resistors to reduce overshoot and undershoot and

are designed to sink/source up to 12 mA at VCC = 3.0V.

The LCX162244 is fabricated with an advanced CMOS

technology to achieve high speed operation while maintain-

ing CMOS low power dissipation.

Features

s 5V tolerant inputs and outputs

s 2.3V–3.6V VCC specifications provided

s Outputs include equivalent series resistance of 26Ω to

make external termination resistors unnecessary and

reduce overshoot and undershoot

s 5.3 ns tPD max (VCC = 3.0V), 20 µA ICC max

s Power down high impedance inputs and outputs

s ±12 mA output drive (VCC = 3.0V)

s Implements patented noise/EMI reduction circuitry

s Latch-up performance exceeds 500 mA

s ESD performance:

Human body model > 2000V

Machine model > 200V

s Also packaged in plastic Fine-Pitch Ball Grid Array

(FBGA) (Preliminary)

Ordering Code:

Order Number Package Number

Package Description

74LCX162244GX

(Note 1)

BGA54A

54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide

(Preliminary) [TAPE and REEL]

74LCX162244MEA

(Note 2)

MS48A

48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide

74LCX162244MTD

(Note 2)

MTD48

48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide

Note 1: BGA package available in Tape and Reel only.

Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.

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© 2001 Fairchild Semiconductor Corporation DS500471

www.fairchildsemi.com

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