SK10LVE111(1999) 查看數據表（PDF） - Semtech Corporation
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SK10LVE111 Datasheet PDF : 6 Pages
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SEMTECH
Today's Results...Tomorrow's Vision
Low Voltage 1:9 Differential
ECL/ PECL Clock Driver
SK10LVE111
SK100LVE111
Package Information
–N–
–L–
Y BRK
D
B 0.007 (0.180) M T L – M S N S
U
Z
0.007 (0.180) M T L – M S N S
+
VIEW D-D
W
D
V
28
1
+
X
G1 0.010 (0.250) S T L – M S N S
A 0.007 (0.180) M T L – M S N S
Z
R 0.007 (0.180) M T L – M S N S
C
E
G
0.004 (0.100)
J –T– SEATING PLANE
K
G1
0.010 (0.250) S T L – M S N S
VIEW S
H 0.007 (0.180) M T L – M S N S
K1 VIEW S
F 0.007 (0.180) M T L – M S N S
NOTES:
1. Datums -L-, -M-, and -N- determined where top of lead
shoulder exits plastic body at mold parting line.
2. DIM G1, true position to be measured at Datum -T-,
Seating Plane.
3. DIM R and U do not include mold flash. Allowable mold flash
is 0.010 (0.250) per side.
4. Dimensioning and tolerancing per ANSI Y14.5M, 1982.
5. Controlling Dimension: Inch.
6. The package top may be smaller than the package bottom by
up to 0.012 (0.300). Dimensions R and U are determined at
the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but including
any mismatch betweeen the top and bottom of the plastic body.
7. Dimension H does not include Dambar protrusion or intrusion.
The Dambar protrusion(s) shall not cause the H dimension
to be greater than 0.037 (0.940). The Dambar intrusion(s)
shall not cause the H dimension to be smaller than 0.025
(0.635).
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A
0.485 0.495 12.32 12.57
B
0.485 0.495 12.32 12.57
C
0.165 0.180 4.20 4.57
E
0.090 0.110 2.29 2.79
F
0.013 0.019 0.33 0.48
G
0.050 BSC
1.27 BSC
H
0.026 0.032 0.66 0.81
J
0.020
--
0.51
--
K
0.025
--
0.64
--
R
0.450 0.456 11.43 11.58
U
0.450 0.456 11.43 11.58
V
0.042 0.048 1.07 1.21
W
0.042 0.048 1.07
1.21
X
0.042 0.056 1.07 1.42
Y
--
0.020
--
0.50
Z
2o
10o
2o
10o
G1 0.410 0.430 10.42 10.92
K1 0.040
--
1.02
--
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