SM150 查看數據表（PDF） - StarHope
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SM150 Datasheet PDF : 3 Pages
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PPTC/SM Series
Terminal pad materials
Terminal pad solderability
Termination pad characteristics
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Thermal Derating Curve
Derating Curves for SMD Series
160
140
120
100
80
60
40
20
0
-40
-20
0
20
40
60
80
Temperature (°C)
Typical Time-To-Trip At 25°C
Average Time Current Curves
100
10
1
0.1
0.01
0.1
1
10
Current In Amperes
3.00A
0.50A
0.75A
1.00A
1.25A
1.5A
1.85A
2.0A
2.5A
2.6A
0.3A
100
Recommended Solder Reflow Conditions
SMD Se30r0SieMsPreheating Soldering
Cooling
250
200
190
160
100
0
60-120
30-60
120
sec.
sec.
sec.
‧Recommended reflow methods：IR, vapor phase oven, hot air oven.
‧Devices are not designed to be wave soldered to the bottom side
of the board.
‧Recommended maximum paste thickness is 0.25 mm (0.010 inch).
‧Devices can be cleaned using standard method and solvents.
Note：If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
Reel:
SM030～300
Package Information
2000pcs/Reel
REV.2014.05.01
03 | www.spsemi.cn
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