SM5817 查看數據表（PDF） - Shunye Enterprise

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SM5817

Silicon epitaxial planer type

Shunye Enterprise 

SM5817 THRU SM5819

Schottky Barrier Diodes

Silicon epitaxial planer type

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

MINI MELF

0.020(0.5)

0.012(0.3)

0.146(3.7)

0.130(3.3)

0.073(2.1)

0.068(2.0)

0.020(0.5)

0.012(0.3)

Mechanical data

Case : Molded plastic, MINI-MELF

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.015 gram

MAXIMUM RATINGS (AT TA=25oC unless otherwise noted)

PARAMETER

CONDITIONS

Forward rectified current

See Fig.2

Forward surge current

Reverse current

Thermal resistance

Diode junction capacitance

Storage temperature

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

VR = VRRM TA = 25oC

VR = VRRM TA = 100oC

Junction to ambient

f=1MHz and applied 4vDC reverse voltage

Symbol

IO

IFSM

IR

RqJA

CJ

TSTG

MIN.

-55

TYP.

80

110

MAX.

1.0

UNIT

A

25

A

1.0

10

+150

mA

mA

oC / w

pF

oC

SYMBOLS

SM5817

SM5818

SM5819

MARKING

CODE

-

-

-

V RRM *1 V RMS *2 V R *3

(V)

(V)

(V)

20

14

20

30

21

30

40

28

40

V F *4

(V)

0.45

0.55

0.60

Operating

temperature

( o C)

-55 to +125

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

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