33887 查看數據表（PDF） - Motorola => Freescale
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33887 Datasheet PDF : 28 Pages
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Freescale Semiconductor, Inc.
Transparent Top View of Package
PGND
1
PGND
2
PGND
3
PGND
4
NC
5
NC
6
NC
7
D2
8
NC
9
OUT2
10
OUT2
11
OUT2
12
OUT2
13
NC
14
V+
15
V+
16
V+
17
V+
18
NC
19
NC
20
NC
21
NC
22
CCP
23
D1
24
IN2
25
EN
26
NC
27
54
PGND
53
PGND
52
PGND
51
PGND
50
NC
49
NC
48
NC
47
FB
46
NC
45
OUT1
44
OUT1
43
OUT1
42
OUT1
41
NC
40
V+
39
V+
38
V+
37
V+
36
NC
.35
NC
34
NC
33
NC
32
IN1
31
FS
30
AGND
29
NC
28
NC
SOICW-EP TERMINAL DEFINITIONS
A functional description of each terminal can be found in the System/Application Information section, page 19.
Terminal
1–4, 51–54
5–7, 9, 14, 19–22,
27– 29, 33–36, 41,
46, 48–50
8
Terminal
Name
PGND
NC
D2
10 – 13
15 –18, 37–40
OUT2
V+
Formal Name
Power Ground
No Connect
Definition
High-current power ground.
No internal connection to this terminal.
Disable 2
H-Bridge Output 2
Positive Power Supply
Active LOW input used to simultaneously tri-state disable both H-Bridge
outputs. When D2 is Logic LOW, both outputs are tri-stated.
Output 2 of H-Bridge.
Positive supply connections.
23
24
25
26
30
31
32
42 – 45
47
Pad
CCP
D1
IN2
EN
AGND
FS
IN1
OUT1
FB
Thermal
Interface
Charge Pump Capacitor
Disable 1
Logic Input Control 2
Enable
Analog Ground
Fault Status for H-Bridge
Logic Input Control 1
H-Bridge Output 1
Feedback for H-Bridge
Exposed Pad Thermal
Interface
External reservoir capacitor connection for internal charge pump capacitor.
Active HIGH input used to simultaneously tri-state disable both H-Bridge
outputs. When D1 is Logic HIGH, both outputs are tri-stated.
Logic input control of OUT2 (i.e., IN2 logic HIGH = OUT2 HIGH).
Logic input Enable control of device (i.e., EN logic HIGH = full operation,
EN logic LOW = Sleep Mode).
Low-current analog signal ground.
Open drain active LOW Fault Status output requiring a pullup resistor to
5.0 V.
Logic input control of OUT1 (i.e., IN1 logic HIGH = OUT1 HIGH).
Output 1 of H-Bridge.
Current feedback output providing ground referenced 1/375th ratio of
H-Bridge high-side current.
Exposed pad thermal interface for sinking heat from the device.
Note Must be DC-coupled to analog ground and power ground via very low
impedance path to prevent injection of spurious signals into IC substrate.
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
For More Information On This Product,
Go to: www.freescale.com
33887
5
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