33887 查看數據表（PDF） - Motorola => Freescale

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33887

5.0 A H-Bridge with Load Current Feedback

Motorola => Freescale 

Freescale Semiconductor, Inc.

MAXIMUM RATINGS (continued)

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Unit

THERMAL RESISTANCE (AND PACKAGE DISSIPATION) RATINGS (Note 8), (Note 9), (Note 10), (Note 11)

Junction-to-Board (Bottom Exposed Pad Soldered to Board)

HSOP (6.0 W)

PQFN (4.0 W)

SOICW-EP (2.0 W)

RθJB

~ 5.0

~ 4.3

~ 8.0

°C/W

Junction-to-Ambient, Natural Convection, Single-Layer Board (1s)

(Note 12)

HSOP (6.0 W)

PQFN (4.0 W)

SOICW-EP (2.0 W)

RθJA

~41

~ TBD

~62

°C/W

Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p)

(Note 13)

HSOP (6.0 W)

PQFN (4.0 W)

SOICW-EP (2.0 W)

RθJMA

~30

~ 21.3

~ TBD

°C/W

Junction-to-Case (Exposed Pad) (Note 14)

HSOP (6.0 W)

PQFN (4.0 W)

SOICW-EP (2.0 W)

RθJC

~ 0.5

~ 0.9

~1.5

°C/W

Notes

8. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking.

9. Exposed heatsink pad plus the power and ground terminals comprise the main heat conduction paths. The actual RθJB (junction-to-PC board)

values will vary depending on solder thickness and composition and copper trace thickness. Maximum current at maximum die temperature

represents ~16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the RθJC-total must be less than 5.0 °C/W

for maximum load at 70°C ambient. Module thermal design must be planned accordingly.

10. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface

of the board near the package.

11. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient

temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

12. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.

13. Per JEDEC JESD51-6 with the board horizontal.

14. Indicates the average thermal resistance between the die and the exposed pad surface as measured by the cold plate method (MIL SPEC-

883 Method 1012.1) with the cold plate temperature used for the case temperature.

MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA

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