NDT3055 查看數據表（PDF） - Fairchild Semiconductor
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NDT3055 Datasheet PDF : 8 Pages
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Electrical Characteristics (TA = 25 OC unless otherwise noted )
Symbol
Parameter
Conditions
Min Typ
OFF CHARACTERISTICS
BVDSS
∆BVDSS/∆TJ
IDSS
Drain-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Zero Gate Voltage Drain Current
IGSSF
Gate - Body Leakage, Forward
IGSSR
Gate - Body Leakage, Reverse
ON CHARACTERISTICS (Note 2)
VGS = 0 V, ID = 250 µA
ID = 250 µA, Referenced to 25 o C
60
63
VDS = 48 V, VGS = 0 V
VGS = 20 V, VDS = 0 V
VGS = -20 V, VDS = 0 V
TJ =125°C
VGS(th)
Gate Threshold Voltage
RDS(ON)
Static Drain-Source On-Resistance
ID(ON)
On-State Drain Current
gFS
Forward Transconductance
DYNAMIC CHARACTERISTICS
VDS = VGS, ID = 250 µA
VGS = 10 V, ID = 4 A
VGS = 10 V, VDS = 10 V
VDS = 15 V, ID = 4 A
2
TJ =125°C 1.5
TJ =125°C
15
3
2.4
0.084
0.14
6
Ciss
Input Capacitance
Coss
Output Capacitance
VDS = 30 V, VGS = 0 V,
250
f = 1.0 MHz
100
Crss
Reverse Transfer Capacitance
30
SWITCHING CHARACTERISTICS (Note 2)
tD(on)
Turn - On Delay Time
tr
Turn - On Rise Time
VDD = 25 V, ID = 1.2 A,
10
VGS = 10 V, RGEN = 50 Ω
18
tD(off)
Turn - Off Delay Time
37
tf
Turn - Off Fall Time
30
Qg
Total Gate Charge
VDS = 40 V, ID = 4 A,
9
Qgs
Gate-Source Charge
VGS = 10 V
2.3
Qgd
Gate-Drain Charge
2.6
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
IS
Maximum Continuous Drain-Source Diode Forward Current
VSD
Drain-Source Diode Forward Voltage
VGS = 0 V, IS = 2.5 A (Note 2)
0.85
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
guaranteed by design while RθCA is determined by the user's board design.
Typical RθJA using the board layouts shown below on FR-4 PCB in a still air environment:
Max Units
V
mV/o C
10
µA
100
µA
100
nA
-100
nA
4
V
3
0.1
Ω
0.18
A
S
pF
pF
pF
25
ns
50
ns
65
ns
60
ns
15
nC
nC
nC
2.5
A
1.2
V
the drain pins. RθJC is
a. 42oC/W when mounted on a 1 in2 pad of
2oz Cu.
b. 95oC/W when mounted on a
pad of 2oz Cu.
0.066 in2
c. 110oC/W when mounted on a 0.00123
in2 pad of 2oz Cu.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
NDT3055 Rev.B
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