AH2 查看數據表（PDF） - TriQuint Semiconductor

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AH2

High Dynamic Range Amplifier

TriQuint Semiconductor 

AH2

High Dynamic Range Amplifier

AH2-G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded

(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Product Marking

The AH2-G will be marked with an “AH2G”

designator. An alphanumeric lot code

(“XXXX-X”) is also marked below the part

designator on the top surface of the package.

The obsolete tin-lead package is marked with

an “AH2” designator followed by an

alphanumeric lot code.

Tape and reel specifications for this part are

located on the website in the “Application

Notes” section.

Land Pattern

MSL / ESD Rating

ESD Rating: Class 1B

Value:

Passes ኑ500V to <1000V

Test:

Human Body Model (HBM)

Standard: JEDEC Standard JESD22-A114

ESD Rating: Class IV

Value:

Passes ኑ1000V to <2000V

Test:

Charged Device Model (CDM)

Standard: JEDEC Standard JESD22-C101

MSL Rating: Level 1 at +260 °C convection reflow

Standard: JEDEC Standard J-STD-020

Mounting Config. Notes

Thermal Specifications

Parameter

Rating

MTTF vs. GND Tab Temperature

1000

1. Ground / thermal vias are critical for the proper

performance of this device. Vias should use a .35mm

(#80 / .0135”) diameter drill and have a final plated

thru diameter of .25 mm (.010”).

Operating Case Temperature

Thermal Resistance, Rth (1)

-40 to +85 °C

59 °C / W

100

2. Add as much copper as possible to inner and outer

layers near the part to ensure optimal thermal

performance.

Junction Temperature, Tj (2)

129 °C

3. Mounting screws can be added near the part to fasten

the board to a heatsink. Ensure that the ground /

10

1. The thermal resistance is referenced from the hottest

thermal via region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board

part of the junction to the ground tab (pin 4).

in the region where the board contacts the heatsink.

2. This corresponds to the typical biasing condition of

+5V, 150 mA at an 85 °C case temperature. A

minimum MTTF of 1 million hours is achieved for

junction temperatures below 160 °C.

5. RF trace width depends upon the PC board material

1

and construction.

60 70 80 90 100 110 6. Use 1 oz. Copper minimum.

Tab Temperature (°C)

7. All dimensions are in millimeters (inches). Angles are

in degrees.

Data Sheet: June 2012

© 2012 TriQuint Semiconductor, Inc.

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Disclaimer: Subject to change without notice

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