TISP3070H3SL 查看數據表（PDF） - Power Innovations

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TISP3070H3SL

DUAL BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS

Power Innovations 

TISP3070H3SL THRU TISP3095H3SL, TISP3125H3SL THRU TISP3210H3SL

TISP3250H3SL THRU TISP3350H3SL

DUAL BIDIRECTIONAL THYRISTOR OVERVOLTAGE PROTECTORS

JANUARY 1999 - REVISED MAY 1999

normal system voltage levels

The protector should not clip or limit the voltages that occur in normal system operation. For unusual

conditions, such as ringing without the line connected, some degree of clipping is permissible. Under this

condition, about 10 V of clipping is normally possible without activating the ring trip circuit.

Figure 9 allows the calculation of the protector VDRM value at temperatures below 25 °C. The calculated value

should not be less than the maximum normal system voltages. The TISP3290H3, with a VDRM of 220 V, can

be used for the protection of ring generators producing 105 V rms of ring on a battery voltage of -58 V. The

peak ring voltage will be 58 + 1.414*105 = 206.5 V. However, this is the open circuit voltage and the

connection of the line and its equipment will reduce the peak voltage.

For the extreme case of an unconnected line, the temperature at which clipping begins can be calculated

using the data from Figure 9. To possibly clip, the VDRM value has to be 206.5 V. This is a reduction of the

220 V 25 °C VDRM value by a factor of 206.5/220 = 0.94. Figure 9 shows that a 0.94 reduction will occur at an

ambient temperature of -32 °C. In this example, the TISP3290H3 will allow normal equipment operation, even

on an open-circuit line, provided that the minimum expected ambient temperature does not fall below -32 °C.

JESD51 thermal measurement method

To standardise thermal measurements, the EIA (Electronic Industries Alliance) has created the JESD51

standard. Part 2 of the standard (JESD51-2, 1995) describes the test environment. This is a 0.0283 m3 (1 ft3)

cube which contains the test PCB (Printed Circuit Board) horizontally mounted at the centre. Part 3 of the

standard (JESD51-3, 1996) defines two test PCBs for surface mount components; one for packages smaller

than 27 mm on a side and the other for packages up to 48 mm. The thermal measurements used the smaller

76.2 mm x 114.3 mm (3.0 “ x 4.5 “) PCB. The JESD51-3 PCBs are designed to have low effective thermal

conductivity (high thermal resistance) and represent a worse case condition. The PCBs used in the majority

of applications will achieve lower values of thermal resistance and so can dissipate higher power levels than

indicated by the JESD51 values.

PRODUCT INFORMATION

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