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SG1842 查看數據表(PDF) - Microsemi Corporation

零件编号
产品描述 (功能)
生产厂家
SG1842
Microsemi
Microsemi Corporation Microsemi
SG1842 Datasheet PDF : 24 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Current Mode PWM Controller
Absolute Maximum Ratings1 - 2
Parameter
Value
Supply Voltage (ICC < 30mA)
Supply Voltage (Low Impedance Source)
Self-limiting
30
Output Current (Peak)
±1
Output Current (Continuous)
350
Output Energy (Capacitive Load)
5
Analog Inputs (VFB, ISENSE)
Error Amplifier Output Sink Current
-0.3 to +6.3
10
Power Dissipation at TA = 25°C (DIL-8)
1
Operating Junction Temperature
Hermetic (J, Y, F, L Packages)
150
Plastic (N, M, D, DM Packages)
150
Storage Temperature Range
-65 to +150
Lead Temperature (Soldering, 10 Seconds)
300
RoHS / Pb-free Peak Package Solder Reflow Temp. (40 second
max. exposure)
260 (+0, -5)
Notes:
1. Exceeding these ratings could cause damage to the device.
2. All voltages are with respect to Pin 5. All currents are positive into the specified terminal.
Units
V
V
A
mA
µJ
V
mA
W
°C
°C
°C
°C
°C
Thermal Data
Parameter
Value
Units
M Package:
Thermal Resistance-Junction to Ambient, θJA
N Package:
Thermal Resistance-Junction to Ambient, θJA
DM Package:
Thermal Resistance-Junction to Ambient, θJA
D Package:
95
°C/W
65
°C/W
165
°C/W
Thermal Resistance-Junction to Ambient, θJA
120
°C/W
Y Package:
Thermal Resistance-Junction to Ambient, θJA
130
°C/W
J Package
Thermal Resistance-Junction to Ambient, θJA
80
°C/W
F Package
Thermal Resistance-Junction to Case, θJC
80
°C/W
Thermal Resistance-Junction to Ambient, θJA
145
°C/W
L Package
Thermal Resistance-Junction to Case, θJC
35
°C/W
Thermal Resistance-Junction to Ambient, θJA
120
°C/W
Notes:
1. Junction Temperature Calculation: TJ = TA + (PD × θJA).
2. The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no
ambient airflow.
4

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