672M-02 查看數據表（PDF） - Integrated Device Technology
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672M-02 Datasheet PDF : 8 Pages
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ICS672-01/02
QUADRACLOCK QUADRATURE DELAY BUFFER
ZERO DELAY BUFFER
Parameter
Operating Supply
Current
Short Circuit Current
Input Capacitance
Symbol
Conditions
IDD No Load, S1=1, S0=0,
S2=0, Notes 2, 6
No Load, S1=1, S0=0,
S2=0, Notes 2, 7
IOS Each output
CIN OE, select pins
Min.
Typ.
22
66
±50
7
Max.
Units
mA
mA
mA
pF
AC Electrical Characteristics
VDD = VDDIO = 3.3 V, Ambient Temperature 0 to +70° C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Clock Frequency
Output Clock Frequency
fIN
Note 3
ICS672-01
5
150 MHz
15
84 MHz
Output Clock Frequency
ICS672-02
15
135 MHz
Output Rise Time
tOR 0.8 to 2.0 V, no load, CL = 15 pF
1.0 ns
Output Fall Time
tOF 2.0 to 0.8 V, no load, CL = 15 pF
1.0 ns
Output Clock Duty Cycle,
VDDIO = 3.3 V
tDC At VDDIO/2
45
50 55
%
Phased Outputs
Accuracy
Rising edges at VDDIO/2,
Note 4
-250
250 ps
Input to Output Skew
ICLK to CLK0, Note 5
-300
300 ps
Maximum Absolute Jitter
75
ps
Cycle to Cycle Jitter
15 pF loads
150
ps
Note 1: With ICLK = 20 MHz, FBCLK to FBIN, all outputs at 40 MHz.
Note 2: With ICLK = 66.5 MHz, FBCLK to FBIN, all outputs at 133 MHz.
Note 3: Value depends on multiplier. Must also meet output clock frequency.
Note 4: With CLK0CLK270 equally loaded, and output frequency > 60 MHz.
Note 5: Rising edge of ICLK compared with rising edge of CLk0, with FBCLK connected to FBIN, 15 pF load on
CLK0, and CLK0 > 60 MHz.
Note 6: Commercial grade.
Note 7: Industrial grade.
Thermal Characteristics
Parameter
Symbol Conditions
Thermal Resistance Junction to
Ambient
θJA Still air
θJA 1 m/s air flow
θJA 3 m/s air flow
Thermal Resistance Junction to Case θJC
Min.
Typ.
120
115
105
58
Max.
Units
° C/W
° C/W
° C/W
° C/W
IDT™ / ICS™ QUADRACLOCK QUADRATURE DELAY BUFFER
5
ICS672-01/02 REV J 110409
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