74F827 查看數據表（PDF） - NXP Semiconductors.
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74F827 Datasheet PDF : 13 Pages
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NXP Semiconductors
12. Package outline
74F827
10-bit buffer/line driver; non-inverting; 3-state
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
y
Z
24
c
13
E
A
X
HE
vM A
pin 1 index
1
e
12
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1) E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25 0.25
0.1
0.9
0.4
8o
inches
0.1
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.394
0.055
0.043
0.016
0.043
0.039
0.01
0.01
0.004
0.035
0.016
0o
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
OUTLINE
VERSION
SOT137-1
IEC
075E05
REFERENCES
JEDEC
JEITA
MS-013
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 8. Package outline SOT137-1 (SO24)
74F827_4
Product data sheet
Rev. 04 — 29 January 2010
© NXP B.V. 2010. All rights reserved.
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