MC100EP11(2003) 查看數據表（PDF） - ON Semiconductor
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MC100EP11 Datasheet PDF : 8 Pages
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MC10EP11, MC100EP11
PACKAGE DIMENSIONS
−X−
A
SO−8
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751−07
ISSUE AA
8
5
B
S
0.25 (0.010) M Y M
1
4
−Y−
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
−Z−
H
G
D
C
SEATING
PLANE
N X 45 _
0.10 (0.004)
M
0.25 (0.010) M Z Y S X S
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.197
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G
1.27 BSC
0.050 BSC
H 0.10 0.25 0.004 0.010
J
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0_ 8_ 0_ 8_
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
TSSOP−8
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948R−02
ISSUE A
0.15 (0.006) T U S
2X L/2
L
PIN 1
IDENT
0.15 (0.006) T U S
8x K REF
0.10 (0.004) M T U S V S
8
5
B
−U−
1
4
A
−V−
0.25 (0.010)
M
F
DETAIL E
C
0.10 (0.004)
−T− SEATING
D
PLANE
G
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
−W−
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 2.90 3.10 0.114 0.122
B 2.90 3.10 0.114 0.122
C 0.80 1.10 0.031 0.043
D 0.05 0.15 0.002 0.006
F 0.40 0.70 0.016 0.028
G
0.65 BSC
0.026 BSC
K 0.25 0.40 0.010 0.016
L
4.90 BSC
0.193 BSC
M 0_ 6 _ 0_ 6_
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