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PK10DN32VLQ10 查看數據表(PDF) - NXP Semiconductors.

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PK10DN32VLQ10
NXP
NXP Semiconductors. NXP
PK10DN32VLQ10 Datasheet PDF : 75 Pages
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Freescale Semiconductor, Inc.
Data Sheet Addendum
Document Number: K10P81M100SF2V2AD
Rev. 0, 09/2017
Addendum to Rev. 3 of the
K10P81M100SF2V2, K10 Sub-Family
Data Sheet
Supports: MK10DN512VLK10
This addendum identifies changes to Rev. 3 of the K10P81M100SF2V2, K10 Sub-Family Data Sheet.
The change described in this addendum has not been implemented in the Rev. 3 data sheet.
In the Thermal attributes section, the thermal resistance parameter (junction to case, RJC) is now 9°C/W
(it was previously 8°C/W).
5.4.2 Thermal attributes
Board type
Symbol
Description
RJC Thermal resistance, junction to case
80 LQFP
9
Unit
C/W
Notes
4
© 2017 Freescale Semiconductor, Inc. All rights reserved.

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