P0406FC05C(2011) 查看數據表（PDF） - ProTek Devices.
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P0406FC05C Datasheet PDF : 9 Pages
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250w flip chip tvs array
P0406FC3.3C - P0406FC36C
Description
The P0406FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Dis-
charge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 require-
ments. These devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per line for an 8/20µs waveform. In addition, the
P0406FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance
virtually eliminates overshoot voltage due to package inductance.
Features
• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
• Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
• ESD Protection > 25 kilovolts
• Available in Voltages Ranging from 3.3V to 36V
• 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
• Protection for 3 to 5 Lines
• RoHS Compliant
• REACH Compliant
Mechanical characteristics
• Standard EIA Chip Size: 0406
• Approximate Weight: 0.73 milligrams
• Lead-Free Plating
• Solder Reflow Temperature:
• Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
• Flammability Rating UL 94V-0
• 8mm Tape per EIA Standard 481
• Top Contacts: Solder Bump 0.004” in Height (Nominal)
applications
• Cellular Phones
• MCM Boards
• Wireless Communication Circuits
• IR LEDs
• SMART & PCMCIA Cards
PIN CONFIGURATION
05155.R6 2/11
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