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NCV8705 查看數據表(PDF) - ON Semiconductor

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NCV8705 Datasheet PDF : 23 Pages
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NCV8705
Table 1. PIN FUNCTION DESCRIPTION
Pin
Name
Pin No. −
Fixed
DFN8/DFNW8
Pin No. −
Adjustable
DFN8/DFNW8
Pin No. −
Fixed
WDFN6
OUT
1
1
1
GND
4
4
3
EN
5
5
4
IN
8
8
6
ADJ
3
N/C
2, 3, 6, 7
2, 6, 7
2, 5
Pin No. −
Adjustable
WDFN6
1
3
4
6
2
5
Description
Regulated output voltage pin. A small 1 mF ceramic capac-
itor is needed from this pin to ground to assure stability.
Power supply ground. Expose pad must be tied with
GND pin. Soldered to the copper plane allows for effective
heat dissipation.
Enable pin. Driving EN over 0.9 V turns on the regulator.
Driving EN below 0.4 V puts the regulator into shutdown
mode.
Input pin. A small capacitor is needed from this pin to
ground to assure stability.
Feedback pin for set−up output voltage. Use resistor di-
vider for voltage selection.
Not connected. This pin can be tied to ground to improve
thermal dissipation.
Table 2. ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (Note 1)
VIN
−0.3 V to 6 V
V
Output Voltage
VOUT
−0.3 V to VIN + 0.3 V
V
Enable Input
VEN
−0.3 V to VIN + 0.3 V
V
Adjustable Input
VADJ
−0.3 V to VIN + 0.3 V
V
Output Short Circuit Duration
tSC
Indefinite
s
Maximum Junction Temperature
TJ(MAX)
125
°C
Storage Temperature
TSTG
−55 to 150
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
Table 3. THERMAL CHARACTERISTICS (Note 3)
Rating
Thermal Characteristics, WDFN6 2x2 mm
Thermal Resistance, Junction−to−Air
Thermal Resistance Parameter, Junction−to−Board
Thermal Characteristics, DFN8 3x3 mm / DFNW8 3x3 mm
Thermal Resistance, Junction−to−Air
Thermal Resistance Parameter, Junction−to−Board
3. Single component mounted on 1 oz, FR 4 PCB with 645 mm2 Cu area.
Symbol
qJA
YJB
qJA
YJB
Value
116.5
30
92.6
35.1
Unit
°C/W
°C/W
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