DAC08RC/883C 查看數據表（PDF） - Analog Devices

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DAC08RC/883C

8-Bit, High Speed, Multiplying D/A Converter

Analog Devices 

Data Sheet

10.00 (0.3937)

9.80 (0.3858)

16

4.00 (0.1575)

3.80 (0.1496) 1

9 6.20 (0.2441)

8 5.80 (0.2283)

0.25 (0.0098)

0.10 (0.0039)

COPLANARITY

0.10

1.27 (0.0500)

BSC

0.51 (0.0201)

0.31 (0.0122)

1.75 (0.0689)

1.35 (0.0531)

8°

0°

SEATING

PLANE

0.25 (0.0098)

0.17 (0.0067)

0.50 (0.0197) 45°

0.25 (0.0098)

1.27 (0.0500)

0.40 (0.0157)

ORDERING GUIDE

Model1, 2, 3

NL

DAC08AQ

±0.10%

DAC08AQ/883C ±0.10%

DAC08HQ

±0.10%

DAC08Q

±0.19%

DAC08RC/883C ±0.19%

DAC08EQ

±0.19%

DAC08ES

±0.19%

DAC08ESZ

±0.19%

DAC08ESZ-REEL ±0.19%

DAC08CP

±0.39%

DAC08CPZ

±0.39%

DAC08CS

±0.39%

DAC08CS-REEL ±0.39%

DAC08CSZ

±0.39%

DAC08CSZ-REEL ±0.39%

DAC08EPZ

±0.19%

COMPLIANT TO JEDEC STANDARDS MS-012-AC

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

Figure 36. 16-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-16)

Dimensions shown in millimeters and (inches)

0.100 (2.54)

0.064 (1.63)

0.358 (9.09)

0.342 (8.69)

SQ

0.358

(9.09)

MAX

SQ

0.088 (2.24)

0.054 (1.37)

0.075 (1.91)

REF

0.095 (2.41)

0.075 (1.90)

0.011 (0.28)

0.007 (0.18)

R TYP

0.075 (1.91)

REF

0.055 (1.40)

0.045 (1.14)

0.200 (5.08)

REF

0.100 (2.54) REF

19

3

18 20

4

1

BOTTOM

VIEW

14

8

13

9

0.015 (0.38)

MIN

0.028 (0.71)

0.022 (0.56)

0.050 (1.27)

BSC

45° TYP

0.150 (3.81)

BSC

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN

Figure 37. 20-Terminal Ceramic Leadless Chip Carrier [LCC]

(E-20-1)

Dimensions shown in inches and (millimeters)

Temperature Range

−55°C to +125°C

−55°C to +125°C

0°C to 70°C

−55°C to +125°C

−55°C to +125°C

0°C to 70°C

0°C to 70°C

0°C to 70°C

0°C to 70°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

0°C to 70°C

Package Description

16-Lead CERDIP

16-Lead CERDIP

16-Lead CERDIP

16-Lead CERDIP

20-Terminal LCC

16-Lead CERDIP

16-Lead SOIC

16-Lead SOIC

16-Lead SOIC

16-Lead PDIP

16-Lead PDIP

16-Lead SOIC

16-Lead SOIC

16-Lead SOIC

16-Lead SOIC

16-Lead PDIP

Package Option

Q-16

Q-16

Q-16

Q-16

E-20-1

Q-16

R-16

R-16

R-16

N-16

N-16

R-16

R-16

R-16

R-16

N-16

1 Devices processed in total compliance to MIL-STD-883. Consult the factory for the 883 data sheet.

2 For availability and burn-in information on the SOIC package, contact your local sales office.

3 Z = RoHS Compliant Part.

DAC08

No. Parts Per Container

25

25

25

25

55

25

47

47

2500

25

25

47

2500

47

2500

25

Rev. D | Page 19 of 21

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