HCPL-073A 查看數據表（PDF） - Avago Technologies

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HCPL-073A

Very Low Power Consumption High Gain Optocouplers

Avago Technologies 

Small-Outline SO-8 Package (HCPL-070A, HCPL-073A)

LAND PATTERN RECOMMENDATION

8

3.937 ± 0.127

(0.155 ± 0.005)

PIN ONE 1

0.406 ± 0.076

(0.016 ± 0.003)

765

XXX

YWW

234

5.994 ± 0.203

(0.236 ± 0.008)

TYPE NUMBER

(LAST 3 DIGITS)

DATE CODE

1.270 BSC

(0.050)

7.49 (0.295)

1.9 (0.075)

0.64 (0.025)

* 5.080 ± 0.127

(0.200 ± 0.005)

7°

45°

X

0.432

(0.017)

3.175 ± 0.127

(0.125 ± 0.005)

1.524

(0.060)

0.228 ± 0.025

(0.009 ± 0.001)

* TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)

5.207 ± 0.254 (0.205 ± 0.010)

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.

0.203 ± 0.102

(0.008 ± 0.004)

0.305 MIN.

(0.012)

NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.

Solder Reflow Thermal Profile

300

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK

TEMP.

245°C

200

160°C

150°C

140°C

100

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

PREHEATING TIME

150°C, 90 + 30 SEC.

30

SEC.

30

SEC.

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

50 SEC.

ROOM

TEMPERATURE

0

0

TIGHT

TYPICAL

LOOSE

50

100

150

200

250

TIME (SECONDS)

Note: Non-halide flux should be used.

Figure 1a. Solder Reflow Thermal Profile.

6

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