HGTG20N60A4, HGTP20N60A4
TO-220AB (Alternate Version)
3 LEAD JEDEC TO-220AB PLASTIC PACKAGE
ØP
E
A
Q
H1
D
A1
TERM. 4
L1
L
60o
b1
b
123
e
e1
c
J1
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.170
0.180
4.32
4.57
-
A1
0.048
0.052
1.22
1.32
2, 4
b
0.030
0.034
0.77
0.86
2, 4
b1
0.045
0.055
1.15
1.39
2, 4
c
0.018
0.022
0.46
0.55
2, 4
D
0.590
0.610 14.99
15.49
-
E
0.395
0.405 10.04
10.28
-
e
0.100 TYP
2.54 TYP
5
e1
0.200 BSC
5.08 BSC
5
H1
0.235
0.255
5.97
6.47
-
J1
0.095
0.105
2.42
2.66
6
L
0.530
0.550 13.47
13.97
-
L1
0.110
0.130
2.80
3.30
3
ØP
0.149
0.153
3.79
3.88
-
Q
0.105
0.115
2.66
2.92
-
NOTES:
1. These dimensions are within allowable dimensions of Rev. J of
JEDEC TO-220AB outline dated 3-24-87.
2. Dimension (without solder).
3. Solder finish uncontrolled in this area.
4. Add typically 0.002 inches (0.05mm) for solder plating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bot-
tom of dimension D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bot-
tom of dimension D.
7. Controlling dimension: Inch.
8. Revision 3 dated 7-97.
8