MCM69L737A 查看數據表（PDF） - Motorola => Freescale
零件编号
产品描述 (功能)
生产厂家
MCM69L737A Datasheet PDF : 20 Pages
| |||
ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to VSS, See Note 1)
Rating
Symbol
Value
Unit
Core Supply Voltage
VDD
– 0.5 to + 4.6
V
Output Supply Voltage
VDDQ – 0.5 to VDD + 0.5 V
Voltage On Any Pin
Vin – 0.5 to VDD + 0.5 V
Input Current (per I/O)
Iin
± 50
mA
Output Current (per I/O)
Iout
± 70
mA
Power Dissipation (See Note 2)
PD
—
W
Operating Temperature
TA
0 to + 70
°C
Temperature Under Bias
Tbias
– 10 to + 85
°C
Storage Temperature
Tstg
– 55 to + 125
°C
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
2. Power dissipation capability will be dependent upon package characteristics and use
environment. See enclosed thermal impedance data.
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.
This BiCMOS memory circuit has been
designed to meet the dc and ac specifications
shown in the tables, after thermal equilibrium
has been established.
This device contains circuitry that will ensure
the output devices are in High–Z at power up.
PBGA PACKAGE THERMAL CHARACTERISTICS
Rating
Symbol
Max
Unit
Notes
Junction to Ambient (Still Air)
RθJA
53
°C/W
1, 2
Junction to Ambient (@200 ft/min)
Single Layer Board
RθJA
38
°C/W
1, 2
Junction to Ambient (@200 ft/min)
Four Layer Board
RθJA
22
°C/W
Junction to Board (Bottom)
RθJB
14
°C/W
3
Junction to Case (Top)
RθJC
5
°C/W
4
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC–883
Method 1012.1).
CLOCK TRUTH TABLE
K CLK
ZZ
SS
L–H
L
L
L–H
L
L
L–H
L
L
L–H
L
L
L–H
L
L
L–H
L
L
L–H
L
L
L–H
L
H
X
H
X
SW
SBa
SBb
SBc
SBd
DQ (n) DQ (n+1)
Mode
H
X
X
X
X
Dout 0–35
X
Read Cycle All Bytes
L
L
H
H
H
High–Z
Din 0–8
Write Cycle 1st Byte
L
H
L
H
H
High–Z Din 9–17
Write Cycle 2nd Byte
L
H
H
L
H
High–Z Din 18–26
Write Cycle 3rd Byte
L
H
H
H
L
High–Z Din 27–35
Write Cycle 4th Byte
L
L
L
L
L
High–Z Din 0–35
Write Cycle All Bytes
L
H
H
H
H
High–Z
High–Z
Abort Write Cycle
X
X
X
X
X
High–Z
X
Deselect Cycle
X
X
X
X
X
High–Z
High–Z
Sleep Mode
MOTOROLA FAST SRAM
MCM69L737A•MCM69L819A
5
Share Link: 