TISP4072F3D 查看數據表（PDF） - Power Innovations
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TISP4072F3D Datasheet PDF : 12 Pages
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TISP4072F3, TISP4082F3
SYMMETRICAL TRANSIENT
VOLTAGE SUPPRESSORS
MARCH 1994 - REVISED SEPTEMBER 1997
MECHANICAL DATA
D008
plastic small-outline package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
D008
5,00 (0.197)
4,80 (0.189)
8
7
6
5
Designation per JEDEC Std 30:
PDSO-G8
6,20 (0.244)
5,80 (0.228)
4,00 (0.157)
3,81 (0.150)
1,75 (0.069)
1,35 (0.053)
1
2
3
4
7° NOM
3 Places
0,50 (0.020)
0,25 (0.010)
x 45°NOM
5,21 (0.205)
4,60 (0.181)
0,203 (0.008)
0,102 (0.004)
0,79 (0.031)
0,28 (0.011)
0,51 (0.020)
0,36 (0.014)
8 Places
Pin Spacing
1,27 (0.050)
(see Note A)
6 Places
0,229 (0.0090)
0,190 (0.0075)
7° NOM
4 Places
1,12 (0.044)
0,51 (0.020)
ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES
NOTES: A. Leads are within 0,25 (0.010) radius of true position at maximum material condition.
B. Body dimensions do not include mold flash or protrusion.
C. Mold flash or protrusion shall not exceed 0,15 (0.006).
D. Lead tips to be planar within ±0,051 (0.002).
4° ± 4°
MDXXAA
PRODUCT INFORMATION
9
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