CXP508L4 查看數據表（PDF） - Sony Semiconductor

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CXP508L4

CMOS 4-bit Single Chip Microcomputer

Sony Semiconductor 

Package Outline

Unit: mm

64

64PIN SDIP (PLASTIC) 750mil

+ 0.4

57.6 – 0.1

33

1

32

1.778

0° to 15°

0.5 ± 0.1

0.9 ± 0.15

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-64P-01

SDIP064-P-0750-A

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY / PHENOL RESIN

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

SOLDER PLATING

42 ALLOY

8.6g

51

52

64PIN QFP(PLASTIC)

23.9 ± 0.4

+ 0.4

20.0 – 0.1

33

32

+ 0.1

0.15 – 0.05

0.15

64

1

1.0

20

19

+ 0.15

0.4 – 0.1

+ 0.35

2.75 – 0.15

± 0.12 M

+ 0.2

0.1 – 0.05

SONY CODE

EIAJ CODE

JEDEC CODE

QFP–64P–L01

∗ QFP064–P–1420

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

COPPER /42 ALLOY

PACKAGE WEIGHT

1.5g

– 11 –

CXP508L4/508L6

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