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AUIRF7103QTR 查看數據表(PDF) - Infineon Technologies

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产品描述 (功能)
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AUIRF7103QTR
Infineon
Infineon Technologies Infineon
AUIRF7103QTR Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
AUIRF7103Q
Static @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
V(BR)DSS/TJ
RDS(on)
VGS(th)
gfs
IDSS
IGSS
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Trans conductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
50 ––– ––– V VGS = 0V, ID = 250µA
––– 0.057 ––– V/°C Reference to 25°C, ID = 1mA
–––
–––
–––
–––
130
200
mVVGGSS
=
=
10V, ID = 3.0A 
4.5V, ID = 1.5A 
1.0 ––– 3.0 V VDS = VGS, ID = 250µA
3.4 ––– ––– S VDS = 15V, ID = 3.0A
––– ––– 2.0
––– ––– 25
µA
VDS =40V, VGS = 0V
VDS = 40V,VGS = 0V,TJ =55°C
–––
–––
––– 100
––– -100
nA
VGS = 20V
VGS = -20V
Dynamic Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Total Gate Charge
Qgs
Gate-to-Source Charge
Qgd
Gate-to-Drain Charge
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Diode Characteristics
––– 10 15
ID = 2.0A
––– 1.2 ––– nC VDS = 40V
––– 2.8 –––
VGS = 10V
––– 5.1 –––
VDD = 25V
–––
–––
1.7
15
–––
–––
ns
ID = 1.0A
RG = 6.0
––– 2.3 –––
RD = 25
––– 255 –––
VGS = 0V
––– 69 ––– pF VDS = 25V
––– 29 –––
ƒ = 1.0MHz
Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode)
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
––– ––– 3.0
––– ––– 12
MOSFET symbol
A
showing the
integral reverse
p-n junction diode.
––– ––– 1.2 V TJ = 25°C,IS = 1.5A,VGS = 0V 
––– 35 53 ns TJ = 25°C ,IF = 1.5A,
––– 45 67 nC di/dt = 100A/µs 
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by max. junction temperature.
Pulse width 400µs; duty cycle 2%.
Surface mounted on 1" in square Cu board.
Starting TJ = 25°C, L = 4.9mH, RG = 25, IAS = 3.0A. (See Fig. 12)
ISD 2.0A, di/dt 155A/µs, VDD V(BR)DSS, TJ 175°C.
Limited by TJmax , see Fig.16b, 16c, 19, 20 for typical repetitive avalanche performance.
2
2015-9-30

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