AD8075Z-EVAL 查看數據表（PDF） - Analog Devices

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AD8075Z-EVAL

500 MHz, G = +1 and +2 Triple Video Buffers with Disable

Analog Devices 

ABSOLUTE MAXIMUM RATINGS1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.0 V

Internal Power Dissipation2, 3

AD8074/AD8075 16-Lead TSSOP (RU) . . . . . . . . . . . . . 1 W

Input Voltage

IN0, IN1, IN2 . . . . . . . . . . . . . . . . . . . . . . . . . VEE ≤ VIN ≤ VCC

OE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . DGND ≤ VIN ≤ VCC

Output Short Circuit Duration . . . . . . . . . . . . . . . . . . Indefinite3

Storage Temperature Range . . . . . . . . . . . . . . –65°C to +150°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . . 300°C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2Specification is for device in free air (TA = 25°C).

316-lead plastic TSSOP; θJA = 150.4°C/W. Maximum internal power dissipa-

tion (PD) should be derated for ambient temperature (T A) such that

PD < (150°C – TA)/θJA.

AD8074/AD8075

PIN CONFIGURATION

AD8074 /AD8075

OE 1

16 VCC

DGND 2

IN2 3

G=

+1/+2

15 VCC

14 OUT2

AGND 4

IN1 5

G=

+1/+2

13 VEE

12 OUT1

AGND 6

IN0 7

G=

+1/+2

11 VCC

10 OUT0

VEE 8

9 VEE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD8074/AD8075 features proprietary ESD protection circuitry, permanent damage may occur

on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8074/

AD8075 is limited by the associated rise in junction temperature.

The maximum safe junction temperature for plastic encapsulated

devices is determined by the glass transition temperature of the

plastic, approximately 150°C. Temporarily exceeding this limit

may cause a shift in parametric performance due to a change in

the stresses exerted on the die by the package. Exceeding a junc-

tion temperature of 175°C for an extended period can result in

device failure.

While the AD8074/AD8075 is internally short circuit protected,

this may not be sufficient to guarantee that the maximum junction

temperature (150°C) is not exceeded under all conditions. To

ensure proper operation, it is necessary to observe the maximum

power derating curves shown in Figure 1.

1.5

TJ = 150؇C

1.0

0.5

0

–50

–30

–10 0 10

30

50

70

90

AMBIENT TEMPERATURE – ؇C

Figure 1. Maximum Power Dissipation vs. Temperature

Rev. B

–3–

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