HEF4555BT 查看數據表（PDF） - NXP Semiconductors.
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HEF4555BT Datasheet PDF : 13 Pages
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NXP Semiconductors
13. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil)
HEF4555B
1-of-4 decoder/demultiplexer
SOT38-4
D
L
Z
e
b
16
pin 1 index
A2 A
A1
wM
b1
b2
9
ME
c
(e 1)
MH
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.30
0.53
0.38
1.25
0.85
0.36 19.50 6.48
0.23 18.55 6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
0.76
inches 0.17
0.02
0.13
0.068 0.021 0.049 0.014
0.051 0.015 0.033 0.009
0.77
0.73
0.26
0.24
0.1
0.3
0.14
0.12
0.32 0.39
0.31 0.33
0.01
0.03
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
OUTLINE
VERSION
IEC
SOT38-4
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
95-01-14
03-02-13
Fig 6. Package outline SOT38-4 (DIP16)
HEF4555B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 18 November 2011
© NXP B.V. 2011. All rights reserved.
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