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HMC143 查看數據表(PDF) - Micross Components

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HMC143 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
v05.1007
HMC143 / HMC144
GaAs MMIC DOUBLE-BALANCED
MIXER, 5 - 20 GHz
Outline Drawings (See HMC143/144 Operation Application Note)
HMC143
4
HMC144
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
4 - 32
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

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