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22346UFZ 查看數據表(PDF) - Renesas Electronics

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22346UFZ Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ISL22346
Absolute Maximum Ratings
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Voltage at any Digital Interface Pin
with Respect to GND . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Voltage at any DCP Pin with Respect to GND. . . . . . . -0.3V to VCC
IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA
Latchup (Note 4) . . . . . . . . . . . . . . . . . . Class II, Level B @ +125°C
ESD Ratings
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .350V
Thermal Information
Thermal Resistance (Typical)
JA (°C/W) JC (°C/W)
20 Lead TSSOP (Note 1) . . . . . . . . . . .
95
N/A
20 Lead TQFN (Notes 2, 3) . . . . . . . . .
40
3.0
Maximum Junction Temperature (Plastic Package). . . . . . . . +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Temperature Range (Extended Industrial). . . . . . . .-40°C to +125°C
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V
Power Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15mW
Wiper Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±3.0mA
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
4. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are: using a max positive pulse of 6.5V on the SHDN pin, and using
a max negative pulse of -0.8V for all pins.
Analog Specifications Over recommended operating conditions, unless otherwise stated.
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
(Note 21) (Note 5) (Note 21) UNIT
RTOTAL RH to RL Resistance
W option
U option
10
k
50
k
RH to RL Resistance Tolerance
End-to-End Temperature Coefficient
W and U option
W option
-20
+20
%
±50
ppm/°C
(Note 18)
U option
±80
ppm/°C
(Note 18)
VRH, VRL
RW
CH/CL/CW
(Note 20)
VRH and VRL Terminal Voltages
Wiper Resistance
Potentiometer Capacitance
VRH and VRL to GND
VCC = 3.3V, wiper current = VCC/RTOTAL
0
VCC
V
70
200
10/10/25
pF
ILkgDCP Leakage on DCP Pins
Voltage at pin from GND to VCC
0.1
VOLTAGE DIVIDER MODE (0V @ RLi; VCC @ RHi; measured at RWi, unloaded; i = 0, 1, 2, or 3)
INL
Integral Non-linearity
Monotonic over all tap positions
-1
(Note 10)
1
µA
1
LSB
(Note 6)
DNL
Differential Non-linearity
Monotonic over all tap positions
-0.5
(Note 9)
0.5
LSB
(Note 6)
ZSerror Zero-scale Error
(Note 7)
W option
U option
0
1
5
LSB
0
0.5
2
(Note 6)
FSerror Full-scale error
(Note 8)
W option
U option
-5
-1
0
LSB
-2
-1
0
(Note 6)
VMATCH DCP to DCP Matching
(Note 11)
Any two DCPs at same tap position, same
-2
voltage at all RH terminals, and same voltage
at all RL terminals
2
LSB
(Note 6)
FN6177 Rev 2.00
September 3, 2009
Page 4 of 16

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