MC100LVEL11DTR2 查看數據表（PDF） - ON Semiconductor
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MC100LVEL11DTR2 Datasheet PDF : 8 Pages
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MC100LVEL11
Table 6. AC CHARACTERISTICS VCC = 3.3 V; VEE = 0.0 V or VCC = 0.0 V; VEE = −3.3 V (Note 8)
−40°C
25°C
85°C
Symbol
Characteristic
Min Typ Max Min Typ Max Min Typ Max Unit
fmax
tPLH
tPHL
tSKEW
Maximum Toggle Frequency
Propagation Delay to Output
Within-Device Skew (Note 9)
Device−to−Device (Note 10)
Duty Cycle Skew (Note 11)
1.0
GHz
235
385 255 330 405 285
435 ps
5
20
10 150
20
5
20
10 150
20
5
20 ps
10 150
20
tJITTER
VPP
tr
tf
Random Clock Jitter (RMS)
Input Swing (Note 12)
Output Rise/Fall Times Q
(20% − 80%)
0.6
ps
200
1000 200 1000
200 1000
mV
120
320 120 220 320 120
320 ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
8. VEE can vary ±0.3 V.
9. Within-device skew defined as identical transitions on similar paths through a device.
10. Device−to−device skew for identical transitions at identical VCC levels.
11. Duty cycle skew is the difference between a tPLH and tPHL propagation delay through a device.
12. VPP(min) is the minimum input swing for which AC parameters guaranteed. The device will function properly with input swings below 200 mV,
however, AC delays may move outside of the specified range. The device has a DC gain of ≈40.
800
600
400
200
0
0
200 400 600 800 1000 1200 1400 1600 1800 2000
f (MHz)
Figure 2. Output Swing versus Frequency
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