Q62702-G0058 查看數據表（PDF） - Siemens AG
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Q62702-G0058 Datasheet PDF : 8 Pages
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BGA 425
Typical configuration
Application 1 - 3 (LNA)
Application 4 (Mix)
Appl.1
RF OUT
100 pF
Appl.2
2.2 pF
BGA 425
100 pF
RF IN
+3 V
Appl.3
RF OUT
100 pF
100 pF
RF IN
BGA 425
100 pF
+3 V
BGA 425
100 pF
RF IN
10 nF 100 pF
100 pF
100 nH
RF OUT
EHA07372
10 nF 100 pF
+3 V
EHA07373
Appl.4
1 nF
LO
33 Ω
47 pF 22 nH
BGA 425
RF
10 nF 100 pF
100 pF
47 pF
IF
180 nH
EHA07374
10 nF 100 pF
+V
EHA07375
Note: 1) Large-value capacitors should be connected from pin 6 to ground right at the device
to provide a low impedance path! (appl. 1)
2) The use of plated through holes right at pin 2 and 5 is essential for pc-board-applications.
Thin boards are recommended to minimize the parasitic inductance to ground!
3) For more information please see application note 028 and 030.
SSeemmicioconndduuctcotor rGGrorouupp
33
Jul1-91948--11919-081
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