BGY148A 查看數據表（PDF） - Philips Electronics

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BGY148A

HF amplifier modules

Philips Electronics 

Philips Semiconductors

HF amplifier modules

Product specification

BGY148A; BGY148B

SOLDERING

The indicated temperatures are those at the solder

interfaces.

Advised solder types are types with a liquidus less than or

equal to 210 °C.

Solder dots or solder prints must be large enough to wet

the contact areas.

Soldering can be carried out using a conveyor oven, a hot

air oven, an infrared oven or a combination of these ovens.

A double reflow process is permitted.

Hand soldering must be avoided because the soldering

iron tip can exceed the maximum permitted temperature of

250 °C and damage the module.

The maximum allowed temperature is 250 °C for

5 seconds.

The maximum ramp-up is 10 °C per second.

The maximum cool-down is 5 °C per second.

Cleaning

The following fluids may be used for cleaning:

• Alcohol

• Bio-Act (Terpene Hydrocarbon)

• Acetone.

Ultrasonic cleaning should not be used since this can

cause serious damage to the product.

300

handbook, halfpage

T

(°C)

200

MGM159

100

0

0

1

2

3

4 t (min) 5

Fig.17 Recommended reflow temperature profile.

1998 May 13

8

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