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ZMM55 查看數據表(PDF) - CHENG-YI ELECTRONIC CO., LTD.

零件编号
产品描述 (功能)
生产厂家
ZMM55
CHENG-YI
CHENG-YI ELECTRONIC CO., LTD. CHENG-YI
ZMM55 Datasheet PDF : 4 Pages
1 2 3 4
ZMM55-C2V4 SERIES
PB FREE PRODUCT
SURFACE MOUNT ZENER DIODES
VOLTAGE 2.4 to 100 Volts
POWER 500 mWatts
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
• In compliance with EU RoHS 2002/95/EC directives
MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.03 grams
• Mounting Position: Any
• Packing information
T/R - 2.5K per 7" plastic Reel
MINI-MELF/LL-34
.020(0.5)
.012(0.3)
Unit : inch (mm)
.146(3.7)
.130(3.3)
.020(0.5)
.012(0.3)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation at Tamb = 25 OC
Symbol
PTOT
Junction Temperature
TJ
Storage Temperature Range
TS
Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.
Value
500
175
-65 to +175
Units
mW
OC
OC
Parameter
Symbol
Min.
Thermal Resistance Junction to Ambient Air
RθJA
--
Forward Voltage at IF = 200mA
VF
--
Valid provided that leads at a distance of 8mm from case are kept at ambient temperature.
Typ.
--
--
Max.
0.3
1.5
Units
K/mW
V

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