FPF1003A 查看數據表（PDF） - ON Semiconductor
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FPF1003A Datasheet PDF : 13 Pages
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Physical Dimensions
0.03 C
2X
E
A
F
B
BALL A1
INDEX AREA
D
TOP VIEW
0.03 C
2X
0.05 C
0.06 C
0.625
0.539 E
(Ø0.350)
SOLDER MASK A1
OPENING
(Ø0.250)
Cu Pad
(1.00)
(0.50)
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.332±0.018
0.250±0.025
C
SEATING PLANE D
SIDE VIEWS
0.50
0.005 C A B
Ø0.315 +/- .025
6X
1.00
0.50
12
C
B (Y) ±0.018
A
F
(X) ±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC006AFrev2.
Figure 25. 1.0 x 1.5 mm2 Wafer-Level Chip-Scale Package (WLCSP)
Product-Specific Dimensions
Product
D
E
X
FPF1003A
FPF1004
1480 µm ± 30 µm
1480 µm ± 30 µm
980 µm ± 30 µm
980 µm ± 30 µm
240 µm
240 µm
Y
240 µm
240 µm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2007 Fairchild Semiconductor Corporation
FPF1003A / FPF1004 • Rev. 1.0.6
10
www.fairchildsemi.com
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