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FT8010 查看數據表(PDF) - ON Semiconductor

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FT8010 Datasheet PDF : 15 Pages
First Prev 11 12 13 14 15
Physical Dimensions
0.10 C
2X
1.40
AB
0.663
1.70
(9X)
0.563
PIN#1 IDENT
TOP VIEW
1.80
0.10 C
2X
0.10 C 0.55 MAX. (0.15)
1
0.40
2.10
(10X)0.225
RECOMMENDED
LAND PATTERN
0.08 C
0.05
0.00
SEATING C
PLANE
1.45
9X
0.55
0.45
SIDE VIEW
00..3455 (9X)
3
DETAIL A
0.40
6
1
PIN#1 IDENT
10
00..1255(10X)
BOTTOM VIEW
0.10 C A B
0.05 C
0.55
0.45
PACKAGE
EDGE
0.40
1.85
(10X) 0.225
OPTIONAL MINIMIAL
TOE LAND PATTERN
NOTES:
A. PACKAGE DOES NOT CONFORM TO
ANY JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
E. DRAWING FILENAME: MKT-UMLP10Arev5.
F. FAIRCHILD SEMICONDUCTOR.
45°
0.25
0.15 DETAIL A
SCALE : 2X
LEAD
OPTION 1
SCALE : 2X
LEAD
OPTION 2
SCALE : 2X
Figure 8. 10-Lead, Ultrathin MLP, 1.4 x 1.8 x 0.55 mm Package
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FT8010 • Rev. 1.0.8
11
www.fairchildsemi.com

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