HCS157D/SAMPLE 查看數據表（PDF） - Intersil
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HCS157D/SAMPLE Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
84 x 84 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCS157MS
HCS157MS
1I1 (3)
1Y (4)
2I0 (5)
2I1 (6)
(14) 4I0
(13) 4I1
(12) 4Y
(11) 3I0
(10) 3I1
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS157 is TA14371A.
Spec Number 518833
181
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