RECOMMENDED SOLDERING CONDITIONS
(1) Precautions in mounting the devices by infrared reflow soldering
• Peak reflow temperature
235 ˚C or below (plastic surface temperature)
• Reflow time
30 seconds or less (Time period during which the plastic surface temperature
is 210 ˚C
• Number of reflows Processes
One
• Flux
Rosin flux containing small amount of chlorine (The flux
with a max. chlorine content of 0.2 Wt % is recommended.)
INFRARED RAY REFLOW TEMPERATURE PROFILE
PS9601, PS9601L
120 to 160 ßC
60 to 120 s
(pre-heat)
(Actual heat)
to 10 s
to 30 s
235 ßC Peak
210 ßC
Time (s)
Peak Temperature 230 ºC
or Lower
(2) Precautions in mounting the devices in solder dip method
• Temperature
260 ˚C or below
• Time
10 seconds or less
• Flux
Rosin group flux, where the amount of chloride component is small.
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
DATA SUBJECT TO CHANGE WITHOUT NOTICE
08/06/2001