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MMDF6N02HD Datasheet PDF : 10 Pages
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MMDF6N02HD
Preferred Device
Power MOSFET
6 Amps, 20 Volts
N−Channel SO−8, Dual
These miniature surface mount MOSFETs feature low RDS(on) and
true logic level performance. Dual MOSFET devices are designed for
use in low voltage, high speed switching applications where power
efficiency is important. Typical applications are dc−dc converters, and
power management in portable and battery powered products such as
computers, printers, cellular and cordless phones. They can also be
used for low voltage motor controls in mass storage products such as
disk drives and tape drives.
• Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Logic Level Gate Drive − Can Be Driven by Logic ICs
• Miniature SO−8 Surface Mount Package − Saves Board Space
• Diode Is Characterized for Use In Bridge Circuits
• Diode Exhibits High Speed, With Soft Recovery
• IDSS Specified at Elevated Temperature
• Mounting Information for SO−8 Package Provided
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage (RGS = 1.0 MΩ)
Gate−to−Source Voltage − Continuous
Drain Current − Continuous @ TA = 25°C
Drain Current − Continuous @ TA = 70°C
Drain Current − Single Pulse (tp ≤ 10 μs)
Total Power Dissipation @ TA = 25°C
(Note 1.)
VDSS
VDGR
VGS
ID
ID
IDM
PD
20
Vdc
20
Vdc
± 12 Vdc
6.5
Adc
6.0
52
Apk
2.0 Watts
Operating and Storage Temperature Range TJ, Tstg − 55 to °C
150
Thermal Resistance − Junction to Ambient
Maximum Lead Temperature for Soldering
Purposes
RθJA
TL
62.5 °C/W
260
°C
1. Mounted on 1″ square FR4 or G−10 board (VGS = 4.5 V, @ 10 seconds).
http://onsemi.com
6 AMPERES
20 VOLTS
RDS(on) = 35 mW
N−Channel
D
G
S
MARKING
DIAGRAM
8
SO−8, Dual
CASE 751
STYLE 11
D6N02H
LYWW
1
L
= Location Code
Y
= Year
WW = Work Week
PIN ASSIGNMENT
Source−1
Gate−1
Source−2
Gate−2
18
27
36
45
Top View
Drain−1
Drain−1
Drain−2
Drain−2
ORDERING INFORMATION
Device
Package
Shipping
MMDF6N02HDR2 SO−8 2500 Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
1
August, 2006 − Rev. 3
Publication Order Number:
MMDF6N02HD/D
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