SK10EP111 查看數據表（PDF） - Semtech Corporation
零件编号
产品描述 (功能)
生产厂家
SK10EP111 Datasheet PDF : 4 Pages
| |||
SEMTECH
Today's Results...Tomorrow's Vision
Low-Voltage 1:10 Differential
ECL/PECL/HSTL Clock Driver
SK10EP111
Package Information
1
–T, U, Z –
8
A, B
A1,
B1
32
4X
0.20 (0.008) AB T–U Z
25
24
S, V
S1,V1
17
9
16
SEE DETAIL "Y"
–AB–
–AC–
SEE DETAIL "AD"
G
0.10 (0.004) AC
NOTES:
1. Dimensioning and tolerancing per ANSI
Y14.5M, 1982.
2. Controlling Dimension: Millimeter
3. Datum Plane –AB– is located at bottom
of lead and is coincident with the lead
where the lead exits the plastic body at
the bottom of the parting line.
4. Datums –T–, –U–, and –Z– to be
determined at Datum Plane –AB–.
5. Dimensions S and V to be determined at
Seating Plane –AC–.
6. Dimensions A and B do not include mold
protrusion. Allowable protrusion is 0.250
(0.010) per side. Dimensions A and B
do not include mold mismatch and are
determined at Datum Plane –AB–.
7. Dimension D does not include Dambar
protrusion. Dambar protrusion shall not
cause the D dimension to exceed
0.520 (0.020).
8. Minimum solder plate thickness shall be
0.0075 (0.0003).
9. Exact shape of each corner may vary
from depiction.
˚ 8x M
R
CE
W
H
K
X
Q˚
0.250 (0.010)
GAUGE PLANE
DETAIL AD
–T–, –Ü–, –Z–
AE
P
AE
DETAIL Y
,Base Metal
N
,F
D
N
0.20 (0.008) M AC T–U Z
SECTION AE
MILLIMETERS
INCHES
DIM
MIN
MAX
MIN
MAX
A
7.000 BSC
0.276 BSC
A1
3.500 BSC
0.138 BSC
B
7.000 BSC
0.276 BSC
B1
3.500 BSC
0.138 BSC
C
1.400 1.600 0.055 0.063
D
0.300 0.450 0.012 0.018
E
1.350 1.450 0.053 0.057
F
0.300 0.400 0.012 0.016
G
0.800 BSC
0.031 BSC
H
0.050 0.150 0.002 0.006
J
0.090 0.200 0.004 0.008
K
0.500 0.700 0.020 0.028
M
12o REF
12o REF
N
0.090 0.160 0.004 0.006
P
0.400 BSC
0.016 BSC
Q
1o
5o
1o
5o
R
0.150 0.250 0.006 0.010
S
9.000 BSC
0.354 BSC
S1
4.500 BSC
0.177 BSC
V
9.000 BSC
0.354 BSC
V1
4.500 BSC
0.177 BSC
W
0.200 REF
0.008 REF
X
1.000 REF
0.039 REF
Share Link: 