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MAX3679A 查看數據表(PDF) - Microsemi Corporation

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MAX3679A Datasheet PDF : 12 Pages
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+3.3V, Low-Jitter Crystal to LVPECL
Clock Generator
Layout Considerations
The inputs and outputs are critical paths for the
MAX3679A, and care should be taken to minimize dis-
continuities on these transmission line. Here are some
suggestions for maximizing the MAX3679A’s perfor-
mance:
• An uninterrupted ground plane should be posi-
tioned beneath the clock I/Os.
• Ground pin vias should be placed close to the IC
and the input/output interfaces to allow a return
current path to the MAX3679A and the receive
devices.
• Supply decoupling capacitors should be placed
close to the MAX3679A supply pins.
• Maintain 100Ω differential (or 50Ω single-ended)
transmission line impedance out of the MAX3679A.
• Use good high-frequency layout techniques and a
multilayer board with an uninterrupted ground
plane to minimize EMI and crosstalk.
Refer to the MAX3679A Evaluation Kit for more information.
Exposed-Pad Package
The exposed pad on the 32-pin TQFN package pro-
vides a very low inductance path for return current trav-
eling to the PCB ground plane. The pad is also
electrical ground on the MAX3679A and must be sol-
dered to the circuit board ground for proper electrical
performance.
Pin Configuration
TOP VIEW
32 31 30 29 28 27 26 25
VCCO_B 1
+
GND 2
24 GND
23 QB1_OE
QB0_OE 3
22 SELA1
SELB1 4
SELB0 5
MAX3679A
21 SELA0
20 QA_OE
QAC_OE 6
MR 7
*EP
19 GND
18 VCC
GNDO_A 8
17 VCCA
9 10 11 12 13 14 15 16
THIN QFN
(5mm × 5mm)
*EXPOSED PAD CONNECTED TO GROUND.
Chip Information
TRANSISTOR COUNT: 10,780
PROCESS: BiCMOS
10 ______________________________________________________________________________________

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