MBRF1545CT 查看數據表（PDF） - ON Semiconductor
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MBRF1545CT Datasheet PDF : 4 Pages
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MBRF1545CT
TEST CONDITIONS FOR ISOLATION TESTS*
CLIP
MOUNTED
FULLY ISOLATED PACK-
AGE
LEADS
CLIP
MOUNTED
FULLY ISOLATED PACK-
AGE
0.107″ MIN
LEADS
MOUNTED
FULLY ISOLATED PACK-
AGE
0.107″ MIN
LEADS
HEATSINK
0.110, MIN
HEATSINK
Figure 3. Clip Mounting Position
for Isolation Test Number 1
Figure 4. Clip Mounting Position
for Isolation Test Number 2
* Measurement made between leads and heatsink with all leads shorted together.
HEATSINK
Figure 5. Screw Mounting Position
for Isolation Test Number 3
MOUNTING INFORMATION**
4−40 SCREW
PLAIN WASHER
CLIP
HEATSINK
COMPRESSION WASHER
NUT
HEATSINK
6a. Screw−Mounted
6b. Clip−Mounted
Figure 6. Typical Mounting Techniques
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in . lbs is sufficient to provide
maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the plastic to crack around the mounting
hole, resulting in a loss of isolation capability.
Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package. However, in order to positively ensure
the package integrity of the fully isolated device, Motorola does not recommend exceeding 10 in . lbs of mounting torque under any mounting conditions.
**For more information about mounting power semiconductors see Application Note AN1040.
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