MC33794 查看數據表（PDF） - Freescale Semiconductor
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MC33794 Datasheet PDF : 18 Pages
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MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Rating
Symbol
Value
Unit
Peak VPWR Voltage
Double Battery
1 Minute Maximum TA = 30°C
ESD Voltage
Human Body Model (1)
Machine Model (2)
VPWRPK
40
V
VDBLBAT
V
26.5
V
VESD1
VESD2
± 2000
± 200
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Thermal Resistance
Junction-to-Ambient (3)
Junction-to-Case (4)
Junction-to-Board (5)
TSTG
TA
TJ
RθJA
RθJC
RθJB
-55 to 150
-40 to 85
-40 to 150
41
0.2
3.0
°C
°C
°C
°C/W
Lead Soldering Temperature (for 10 Seconds)
TSOLDER
260
°C
Notes
1. ESD1 performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω).
2. ESD2 performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).
3. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with
SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
4. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
(MILSPEC 883 Method 1012.1) with the cold plate temperature used for the case temperature.
5. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
MC33794
6
Sensors
Freescale Semiconductor
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