CS52510-1 查看數據表（PDF） - ON Semiconductor

零件编号

产品描述 (功能)

生产厂家

CS52510-1

10 A LDO 5−Pin Adjustable Linear Regulator

ON Semiconductor 

CS52510−1

PD(max) + (VIN(max) * VOUT(min))IOUT(max)

) VIN(max) IIN(max)

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air. Each material in the heat flow path

between the IC and the outside environment has a thermal

resistance which is measured in degrees per watt. Like series

electrical resistances, these thermal resistances are summed

to determine the total thermal resistance between the die

junction and the surrounding air, RΘJA. This total thermal

resistance is comprised of three components. These resistive

terms are measured from junction to case (RΘJC), case to

heat sink RΘCS), and heat sink to ambient air (RΘSA). The

equation is:

RQJA + RQJC ) RQCS ) RQSA

The value for RΘJC is 1.4°C/watt for the CS52510−1 in a

TO−220 package. For a high current regulator such as the

CS52510−1 the majority of heat is generated in the power

transistor section. The value for RΘSA depends on the heat

sink type, while the RΘCS depends on factors such as

package type, heat sink interface (is an insulator and thermal

grease used?), and the contact area between the heat sink and

the package. Once these calculations are complete, the

maximum permissible value of RΘJA can be calculated and

the proper heat sink selected. For further discussion on heat

sink selection, see our application note “Thermal

Management,” document number AND8036/D, available

through the Literature Distribution Center or via our website

at http://www.onsemi.com.

http://onsemi.com

9

Share Link: