MAS1017AZAA 查看數據表（PDF） - Micro Analog Systems Oy
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MAS1017AZAA Datasheet PDF : 6 Pages
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PAD LAYOUT
QI
QO
PD
RFI
VSS
2094 µm
DCF
PUP
AGC
DEC
VDD
DA1017.000
April 6, 1999
DIE size = 2.09 x 1.59 mm; PAD size = 100 x 100 µm
Substrate is connected to VDD. Please make sure that VDD is bonded first.
Pad Identification
Power Supply Voltage
Power Supply Ground
Power Down Input
Power Up Input
AGC Capacitor
Demodulator Capacitor
Receiver Input
Quarz Filter Output
Quarz Filter Input
DCF Signal Output
Name
VDD
VSS
PDN
PUP
AGC
DEC
RFI
QO
QI
DCF
X-coordinate
1867 µm
262 µm
242 µm
1859 µm
1859 µm
1859 µm
242 µm
242 µm
242 µm
1859 µm
Y-coordinate
270 µm
257 µm
751 µm
1029 µm
790 µm
514 µm
513 µm
1029 µm
1307 µm
1345 µm
Notes:
1) Level = VSS means receiver on; VDD = receiver off (PUP = VSS)
Internal pull-up resistor > 1 MOhm to VDD
2) Level = VDD means receiver on; VSS = receiver off (PDN = VDD)
Internal pull-down resistor > 1MOhm to VSS
3) 100% AM results in Level = VSS; 25% AM results in Level = VDD
- the output is a current source/sink with |IOUT| > 5 µA
- at power down the output is tri-state
Note
1
2
3
2
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