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5962-8957201EA 查看數據表(PDF) - Avago Technologies

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5962-8957201EA Datasheet PDF : 12 Pages
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HCPL-1930, HCPL-1931, HCPL-193K, 5962-89572
Dual Channel Line Receiver Hermetically
Sealed Optocoupler
Data Sheet
Description
The HCPL-193X devices are dual channel, hermeti-
cally sealed, high CMR, line receiver opto­coup­lers. The
products are capable of operation and storage over the
full military tempera­ture range and can be pur­chased as
either a standard product or with full MIL-PRF-38534 Class
Level H or K testing, or from the DLA Standard Microcircuit
Drawing (SMD) 5962-89572. This sixteen pin DIP may be
purchased with a variety of lead bend and plating options.
See selection guide table for details. Standard Microcircuit
Drawing (SMD) parts are available for each lead style.
Functional Diagram
Features
Dual marked with device part number and DLA
standard microcircuit drawing
Manufactured and tested on a MIL-PRF-38534 certified
line
QML-38534, Class H and Class K
Hermetically sealed 16-pin dual in-line package
Performance guaranteed over full military temperature
range: -55° C to +125° C
High speed – 10 Mb/s
Accepts a broad range of drive conditions
Adaptive line termination included
Internal shield provides excellent common mode
rejection
External base lead allows “LED Peaking” and LED
current adjustment
1500 Vdc withstand test voltage
High radiation immunity
HCPL-2602 function compatibility
Reliability data available
Truth Table (Positive Logic)
INPUT
ON
OFF
ON
OFF
ENABLE
H
H
L
L
OUTPUT
L
H
H
H
Applications
Military and space
High reliability systems
Isolated line receiver
Simplex/multiplex data transmission
Computer-peripheral interface
Microprocessor system interface
Harsh environmental environments
Digital isolation for A/D, D/A conversion
Current sensing
Instrument input/output isolation
Ground loop elimination
Pulse transformer replacement
Note: The connection of a 0.1 µF bypass capacitor between pins 15 and 10 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.

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