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HIP6601B 查看數據表(PDF) - Renesas Electronics

零件编号
产品描述 (功能)
生产厂家
HIP6601B
Renesas
Renesas Electronics Renesas
HIP6601B Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
HIP6601B, HIP6603B, HIP6604B
Ordering Information
TEMP.
PART NUMBER PART RANGE
(Notes 1, 2) MARKING (°C)
PACKAGE PKG.
(Pb-free) DWG. #
HIP6601BCBZ*
6601
BCBZ
0 to +85 8 Ld SOIC M8.15
HIP6601BCBZA* 6601
BCBZ
0 to +85 8 Ld SOIC M8.15
HIP6601BECBZ*
(No longer
available or
supported)
6601
BECBZ
0 to +85 8 Ld
EPSOIC
M8.15B
HIP6601BECBZA* 6601
(No longer
BECBZ
available or
supported)
0 to +85 8 Ld
EPSOIC
M8.15B
HIP6603BCBZ*
6603
BCBZ
0 to +85 8 Ld SOIC M8.15
HIP6603BECBZ*
(No longer
available or
supported)
6603
BECBZ
0 to +85 8 Ld
EPSOIC
M8.15B
HIP6604BCRZ*
(No longer
available or
supported)
66
04BCRZ
0 to +85 16 Ld QFN L16.4x4
*Add “-T” suffix for tape and reel. Please refer to TB347 for details
on reel specifications.
NOTES:
1. These Intersil Pb-free plastic packaged products employ special
Pb-free material sets, molding compounds/die attach materials,
and 100% matte tin plate plus anneal (e3 termination finish,
which is RoHS compliant and compatible with both SnPb and
Pb-free soldering operations). Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet
or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. For Moisture Sensitivity Level (MSL), please see device
information page for HIP6601B, HIP6603B, HIP6604B. For
more information on MSL, please see Technical Brief TB363.
Pinouts
HIP6601BCB, HIP6603BCB,
HIP6601BECB, HIP6603BECB,
(8 LD SOIC, EPSOIC)
TOP VIEW
UGATE 1
BOOT 2
PWM 3
GND 4
8 PHASE
7 PVCC
6 VCC
5 LGATE
HIP6604B
(16 LD QFN)
TOP VIEW
16
NC 1
BOOT 2
PWM 3
GNDNO4LONG5ER
15 14
AVAILABLE OR
67
S1U3PPO1R2TEDNC
11 PVCC
10 LVCC
9 VCC
8
FN9072 Rev 9.00
December 10, 2015
Page 2 of 14

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