7. Soldering Profile
(1) Reflow Soldering Conditions / Profile (Lead Free Solder)
Temp
[°C]
260
240
220
200
180
150
Pre-heating
Rising
5 °C/sec
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
Cooling
-5 °C/sec
0
Time
[Hr]
(2) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 7/13 -
SSC-SFT825N-S