APA3160A 查看數據表（PDF） - Anpec Electronics
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APA3160A Datasheet PDF : 38 Pages
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APA3160A
Ordering and Marking Information
APA3160A
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
QCA : TQFP7x7-48P
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APA3160A QCA :
APA3160A
XXXXX
XXXXX - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
Supply Voltage (PVDD_X to PGND_XX)
-0.3 to 26
Supply Voltage (DVDD to DVSS)
-0.3 to 3.6
Supply Voltage (AVDD to AVSS)
-0.3 to 3.6
Input Voltage (MCLK to AVSS)
Input Voltage (SD, RST, LRCLK, SCLK, SDIN, SDA, SCL to DVSS)
-0.5 to AVDD+2.5
V
-0.5 to DVDD+2.5
Input Voltage (OUT_X to PGND_XX)
-0.3 to +32
Input Voltage (XBS to PGND_XX)
-0.3 to +43
Input Voltage (AVSS, DVSS, AGND to PGND_XX)
-0.3 to +0.3
TJ
TSTG
TSDR
Maximum Junction Temperature
Storage Temperature Range
Soldering Temperature Range, 10 seconds
150
οC
-65 to +150
οC
260
οC
PD
Power Dissipation
Internally Limited
W
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol
θJA
θJC
Parameter
Junction-to-Ambient Resistance in Free Air (Note 2)
Junction-to-Case Resistance in Free Air (Note 3)
TQFP7x7-48P
TQFP7x7-48P
Typical Value
25
-
Unit
°C/W
°C/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
of TQFP7X7-48P is soldered directly on the PCB.
Note 3: The case temperature is measured at the center of the exposed pad on the underside of the TQFP7X7-48P package.
Copyright © ANPEC Electronics Corp.
2
Rev. A.6 - Jan., 2013
www.anpec.com.tw
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