X28HC64 查看數據表（PDF） - Renesas Electronics
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X28HC64 Datasheet PDF : 18 Pages
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X28HC64
Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07)
0.048 (1.22)
0.042 (1.07)
PIN (1)
0.056 (1.42)
IDENTIFIER
0.050 (1.27) TP
CL
ND
0.004 (0.10) C
0.025 (0.64)
0.045 (1.14)
R
D2/E2
E1 E CL
D2/E2
NE
VIEW “A”
0.020 (0.51) MAX
3 PLCS
D1
D
0.050 (1.27)
MIN
0.015 (0.38)
A1
MIN
A
-C-
SEATING
PLANE
0.026 (0.66)
0.032 (0.81)
0.025 (0.64)
MIN
0.013 (0.33)
0.021 (0.53)
(0.12)
0.005
M
A S -B S
DS
VIEW “A” TYP.
N32.45x55 (JEDEC MS-016AE ISSUE A)
32 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.125 0.140 3.18
3.55
-
A1
0.060 0.095 1.53
2.41
-
D
0.485 0.495 12.32 12.57
-
D1
0.447 0.453 11.36 11.50
3
D2
0.188 0.223 4.78
5.66
4, 5
E
0.585 0.595 14.86 15.11
-
E1
0.547 0.553 13.90 14.04
3
E2
0.238 0.273 6.05
6.93
4, 5
N
28
28
6
ND
7
7
7
NE
9
9
7
NOTES:
Rev. 0 7/98
1. Controlling dimension: INCH. Converted millimeter
dimensions are not necessarily exact.
2. Dimensions and tolerancing per ANSI Y14.5M-1982.
3. Dimensions D1 and E1 do not include mold protrusions.
Allowable mold protrusion is 0.010 inch (0.25mm) per side.
Dimensions D1 and E1 include mold mismatch and are
measured at the extreme material condition at the body
parting line.
4. To be measured at seating plane -C- contact point.
5. Centerline to be determined where center leads exit plastic
body.
6. “N” is the number of terminal positions.
7. ND denotes the number of leads on the two shorts sides of the
package, one of which contains pin #1. NE denotes the
number of leads on the two long sides of the package.
FN8109 Rev 4.00
June 27, 2016
Page 16 of 18
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