X28HC64 查看數據表（PDF） - Renesas Electronics

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X28HC64

64k, 8k x 8-Bit 5 Volt, Byte Alterable EEPROM

Renesas Electronics 

X28HC64

Small Outline Plastic Packages (SOIC)

N

INDEX

AREA

H

E

-B-

0.25(0.010) M B M

123

-A- D

SEATING PLANE

A

L

h x 45o

-C-

a

e

A1

C

B

0.10(0.004)

0.25(0.010) M C A M B S

TYPICAL RECOMMENDED LAND PATTERN

(1.50mm)

(9.38mm)

(1.27mm TYP)

(0.51mm TYP)

M28.3 (JEDEC MS-013-AE ISSUE C)

28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE

INCHES

MILLIMETERS

SYMBOL

A

A1

B

C

D

E

MIN

0.0926

0.0040

0.013

0.0091

0.6969

0.2914

MAX

0.1043

0.0118

0.0200

0.0125

0.7125

0.2992

MIN

2.35

0.10

0.33

0.23

17.70

7.40

MAX

2.65

0.30

0.51

0.32

18.10

7.60

NOTES

-

-

9

-

3

4

e

0.05 BSC

1.27 BSC

-

H

0.394 0.419 10.00 10.65

-

h

0.01

0.029 0.25

0.75

5

L

0.016 0.050 0.40

1.27

6

N

28

28

7



0o

8o

0o

8o

-

Rev. 1, 1/13

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of

Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006

inch) per side.

4. Dimension “E” does not include interlead flash or protrusions. Interlead

flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above

the seating plane, shall not exceed a maximum value of 0.61mm (0.024

inch)

10. Controlling dimension: MILLIMETER. Converted inch dimensions are

not necessarily exact.

FN8109 Rev 4.00

June 27, 2016

Page 17 of 18

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