ACPM-7381-OR1 查看數據表（PDF） - Avago Technologies
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ACPM-7381-OR1 Datasheet PDF : 15 Pages
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PCB Design Guidelines
The recommended ACPM-7381 PCB land pattern is
shown in Figure 15 and Figure 16. The substrate is coated
with solder mask between the I/O and conductive paddle
to protect the gold pads from short circuit that is caused
by solder bleeding/bridging.
0.1
0.6
0.5
0.4
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 17. Reducing the stencil opening can po-
tentially generate more voids. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads or conduc-
tive paddle to adjacent I/O pads. Considering the fact
that solder paste thickness will directly affect the quality
of the solder joint, a good choice is to use laser cut stencil
composed of 0.10mm(4mils)or 0.127mm(5mils) thick
stainless steel which is capable of producing the required
fine stencil outline.
0.6
0.5
0.85
0.25
Figure 15. Metallization
0.7
0.5
Ø 0.3mm
on 0.6mm pitch
0.55
1.8
0.4
1.6
0.85
2.0
Figure 17. Solder Paste Stencil Aperture
0.85
2.4
Figure 16. Solder Mask Opening
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