CPC1393 查看數據表（PDF） - Clare Inc => IXYS
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CPC1393 Datasheet PDF : 6 Pages
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CPC1393
Manufacturing Information
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
Pb
RoHS
2002/95/EC
e3
MECHANICAL DIMENSIONS
4-Pin DIP (”G” Suffix)
0.991
(0.039)
6.350 ± 0.127
(0.250 ± 0.005)
3.30 ± 0.050
(0.130 ± 0.002)
4.572 ± 0.127 PIN 1
(0.180 ± 0.005)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.127
(0.100 ± 0.005)
9º (ALL)
1.651
(0.065)
0.508
(0.020)
3.175
(0.125)
0.254
(0.010)
PC Board Pattern (Top View)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
7.620 ± 0.254
(0.300 ± 0.010)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Dimensions
mm
(inches)
4-Pin DIP “V” Package
0.991
(0.039)
0.254
(0.010)
3.30 ± 0.050
(0.130 ± 0.002)
6.350 ± 0.050
(0.250 ± 0.002)
4.572 ± 0.050 Pin 1
(0.180 ± 0.002)
9º (ALL)
0.457 ± 0.076
(0.018 ± 0.003)
2.540 ± 0.050
(0.100 ± 0.002)
1.651
(0.065)
0.127
(0.005)
2.92
(0.115)
9º (ALL)
10.160 ± 0.508
(0.400 ± 0.020)
7.620 ± 0.254
(0.300 ± 0.010)
PC Board Pattern (Top View)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
10.160 ± 0.127
(0.400 ± 0.005)
Dimensions
mm
(inches)
R03
www.clare.com
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